Automated Fabrication Analysis to Prevent Costly PCB Production Issues
Fab Express™
Fab Express™
Automated Fabrication Rule Checking: Detects issues related to copper spacing, minimum trace width, drill clearances, and annular rings.
Layer Stack Analysis: Validates dielectric spacing, copper balancing, and drill-to-layer alignment across multi-layer PCBs.
Advanced Via & Drill Analysis: Identifies potential manufacturing issues involving blind/buried vias, microvias, and complex drill patterns.
Customizable Constraint Parameters: Adaptable rules engine enables users to set fabrication thresholds based on specific supplier requirements.
Multi-CAD Compatibility: Works with industry-standard layout formats (e.g., ODB++, IPC-2581, Gerber, and native CAD files).
Interactive Violation Visualization: Displays violation locations directly on the PCB layout for fast correction and debugging.
Exportable Reports: Generates comprehensive DfF validation reports in PDF or HTML formats to streamline communication with fab houses.
Zero Pre-processing Required: Operates directly on native layout data, eliminating the need for manual translation or data conversion.
FabExpress™ is an automated Design for Fabrication (DfF) analysis tool developed by Aster Technologies to ensure PCB manufacturability early in the design process. Focused on identifying critical fabrication-related issues, FabExpress helps layout engineers avoid production delays and yield losses by analyzing key constraints such as copper balancing, track widths, spacing violations, drill-to-copper distances, and annular rings. Designed to work seamlessly with major CAD formats, FabExpress simplifies DfF validation and accelerates board release to fabrication.
Key Challenges, Streamlined Solutions
FabExpress™ empowers layout engineers to detect and resolve fabrication constraints early—ensuring smoother, faster board release.
Automated analysis of fabrication constraints ensures all critical violations are flagged before release.
Early validation during layout reduces the need for costly board revisions and re-spins.
Supports advanced analysis of vias, pads, drills, and layer-to-layer interactions across multilayer designs.
Automated rule checking identifies violations in track width, copper spacing, and minimum annular ring sizes.
Generates detailed and standardized reports for fast communication with fabrication partners.
Allows configuration of constraint rules based on vendor-specific manufacturing tolerances.
Benefits/Value to the Customer
Accelerated Release to Fab
Speeds up board release cycles by automating checks and removing bottlenecks in the handoff process
Improved Supplier Communication
Clear, structured reports ensure fabrication partners receive accurate, actionable design insights
Reduced Risk of Production Delays
Prevents fabrication errors that lead to board rejections or delivery issues
Higher First-Pass Yield:
Increases production success rates by ensuring the board meets fab constraints from the outset.
Cost
Savings
Minimizes redesign costs by catching manufacturability issues before prototype or mass production
